职责描述: 1. Physical implementation of advanced technology chips. 2. Design methodology development and innovation for advanced technology challenges. 3. Be responsible for 22/16/12/10/7/5nm chip implementation for customer’s projects or internal system test chips. 4. Be responsible for advanced node PPA benchmark, and solution development. 5. EDA tool new features enablement. 6. Customer onsite/offsite supports will be required on demand. 任职要求: 1. MS or above in EE, CS related fields. Experience in APR, physical verification, chip implementation, or CAD development is plus. 2. 3 years working experience in chip physical implementation. 3. Familiar with Synopsys/Cadence APR tools/flows. 4. Familiar with TCL/Perl/Python programming. 5. Experience with TSMC advanced technology is plus. 6. Proven record in production tape-outs is plus.